Model: XG-50

Place of Origin: Hong Kong

Scope of application: mobile phone chip repair computer or home appliance chip patch repair BGA special products chip level repair tools

Applicable models: planting tin for mobile phone repair, BGA planting for electronic industry computers, etc.

Features: The solder joint is white and full, there is no such phenomenon as virtual soldering, false soldering, etc., and it has a strong resilience with the soldering iron tip.

Maintenance of mobile phones, precision equipment must not be small products. It is also an ideal product for welding on electronic production lines.